Bonding Strength Test Service | JTL
We will conduct an evaluation of the bonding strength of micro joints in semiconductor components and electronic components.
In this service, we conduct bonding reliability evaluations of various components in assembly and mounting processes using a bonding strength testing machine (bond tester). We specialize in bonding strength tests for electronic components (shear tests and pull tests), making it suitable for evaluating high-density mounted components. In addition to electronic components, we can also perform bonding strength evaluations on various products and materials in their original state. We have a variety of load cells available, and we design and manufacture original jigs in-house, allowing us to provide flexible responses that are not affected by material or shape.
- Company：JAPAN TESTING LABORATORIES
- Price：Other
